The **ATS-08F-113-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08F-113-C3-R0 | | **Material** | Aluminum (Body), Copper (Optional Base depending on configuration) | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Thermal Resistance** | 1.19 °C/W @ 100 LFM (Linear Feet per Minute) | | **Dimensions** | 40.00mm x 40.00mm x 10.00mm | --- ### 2. Physical Design Details The "08F" in the part number indicates specific design characteristics within the ATS product line: * **Fin Profile:** This model features **XC-CUT** (cross-cut) straight fins. This design allows for multidirectional airflow, making it versatile for systems where the air might not be moving in a perfectly straight path. * **Dimensions:** * **Width/Length:** 40mm x 40mm (Standard square footprint for medium-sized ICs). * **Height:** 10mm (Low profile, ideal for space-constrained enclosures or 1U servers). * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T412** thermal tape or high-performance grease to ensure a low-resistance thermal path between the chip and the heat sink. --- ### 3. Mounting Mechanism: pushPIN™ One of the defining "electronic parts" of this assembly is the attachment hardware. Unlike simple adhesive heat sinks, the **ATS-08F-113-C3-R0** uses a mechanical fastening system: 1. **Push Pins:** Durable nylon or brass pins that snap into pre-drilled holes on the PCB. 2. **Compression Springs:** These provide precise, consistent pressure across the component surface, which prevents the heat sink from shifting and improves thermal conductivity. 3. **Reliability:** Mechanical mounting is preferred in high-vibration environments (like industrial machinery or automotive electronics) where adhesive might fail over time. --- ### 4. Cooling Performance The efficiency of this part is measured by its thermal resistance. Lower values indicate better cooling: * **@ 100 LFM (Airflow):** 1.19 °C/W * **@ 500 LFM (Airflow):** 0.70 °C/W (Approximate) This makes the part suitable for components generating moderate to high heat that require active airflow (fans) to maintain safe operating temperatures.