The **ATS-08F-115-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like processors, FPGAs, and ASICs. --- ### 1. Technical Specifications The part is characterized by its physical dimensions and thermal resistance properties. | Specification | Detail | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | maxiFLOW™ | | **Base Dimensions** | 40mm x 40mm | | **Height** | 22.9mm | | **Material** | Aluminum (with Blue Anodized Finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface** | T766 (Pre-applied Thermal Phase Change Material) | --- ### 2. Design Features The "electronic" functionality of this part is purely passive, but its architecture is engineered for high-efficiency heat dissipation: * **Spread Fin Design:** The fins are tapered and angled outward. This geometry reduces pressure drop and increases the surface area exposed to airflow, making it more efficient than standard straight-fin heat sinks. * **pushPIN™ Attachment:** It uses a specialized mechanical attachment system that provides a specific amount of "force" (pressure) on the electronic chip, ensuring optimal contact with the Thermal Interface Material (TIM). * **Blue Anodized Coating:** The blue coating isn't just for aesthetics; it provides increased surface emissivity and corrosion resistance. --- ### 3. Thermal Performance The efficiency of this heat sink depends on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **200 (1.0 m/s)** | 5.45 | | **400 (2.0 m/s)** | 3.17 | | **600 (3.0 m/s)** | 2.52 | --- ### 4. Implementation Example To use this part in an electronic project, you would typically follow these steps: ```markdown 1. Identify the chip (e.g., FPGA) with a 40x40mm footprint. 2. Ensure the PCB has the specific hole pattern for the pushPIN™ clips. 3. Remove the protective film from the pre-applied T766 thermal pad. 4. Align the heat sink and snap the pins into the PCB. ```