ATS-08F-116-C2-R0
AI

The **ATS-08F-116-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management in electronic components like CPUs, GPUs, and power modules.
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### 1. Technical Specifications
The part number follows a specific nomenclature that defines its physical and thermal characteristics.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Plastic/Brass pins) |
| **Base Dimensions** | 40.00 mm x 40.00 mm |
| **Height** | 25.00 mm |
| **Pin Pitch (Mounting)** | 33.00 mm |
| **Thermal Resistance** | 4.14 °C/W @ 100 LFM |
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### 2. Physical Design Features
* **Fin Style:** Straight-fin design optimized for longitudinal airflow.
* **Thermal Interface Material (TIM):** Pre-applied **T766** high-performance phase-change material, which ensures optimal heat transfer between the component and the heat sink.
* **Mounting System:** The `pushPIN™` mechanism uses a spring-loaded pin to provide consistent pressure, improving thermal contact while preventing damage to the PCB.
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### 3. Thermal Performance Metrics
Thermal resistance indicates how efficiently the heat sink dissipates heat. Lower values are better for high-power applications.
| Airflow Velocity (LFM) | Thermal Resistance (°C/W) |
| :--- | :--- |
| 100 (0.5 m/s) | 4.14 |
| 200 (1.0 m/s) | 2.50 |
| 300 (1.5 m/s) | 1.99 |
| 400 (2.0 m/s) | 1.72 |
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### 4. Part Number Breakdown
The code `ATS-08F-116-C2-R0` can be decoded as follows:
* **ATS**: Advanced Thermal Solutions.
* **08**: Series identifier.
* **F**: Fin pitch/density (usually "Fine").
* **116**: Specific size/geometry code.
* **C2**: Thermal Interface Material (T766) and finish color.
* **R0**: Revision/Packaging code.
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### 5. Common Applications
* **Integrated Circuits (ICs):** Cooling FPGAs or ASICs.
* **Embedded Systems:** Industrial PCs where space is limited but high heat dissipation is required.
* **Power Supplies:** Cooling voltage regulators and MOSFETs.
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What are the advantages of using pushPIN™ over traditional adhesive mounting?
- ⤷ How does the T766 thermal interface material compare to standard thermal grease?
- ⤷ Can this heat sink be used in a passive cooling environment without fans?