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  • ATS-08F-116-C2-R0

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    The **ATS-08F-116-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the **pushPIN™** series, designed specifically for thermal management in electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Plastic/Brass pins) | | **Base Dimensions** | 40.00 mm x 40.00 mm | | **Height** | 25.00 mm | | **Pin Pitch (Mounting)** | 33.00 mm | | **Thermal Resistance** | 4.14 °C/W @ 100 LFM | --- ### 2. Physical Design Features * **Fin Style:** Straight-fin design optimized for longitudinal airflow. * **Thermal Interface Material (TIM):** Pre-applied **T766** high-performance phase-change material, which ensures optimal heat transfer between the component and the heat sink. * **Mounting System:** The `pushPIN™` mechanism uses a spring-loaded pin to provide consistent pressure, improving thermal contact while preventing damage to the PCB. --- ### 3. Thermal Performance Metrics Thermal resistance indicates how efficiently the heat sink dissipates heat. Lower values are better for high-power applications. | Airflow Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 4.14 | | 200 (1.0 m/s) | 2.50 | | 300 (1.5 m/s) | 1.99 | | 400 (2.0 m/s) | 1.72 | --- ### 4. Part Number Breakdown The code `ATS-08F-116-C2-R0` can be decoded as follows: * **ATS**: Advanced Thermal Solutions. * **08**: Series identifier. * **F**: Fin pitch/density (usually "Fine"). * **116**: Specific size/geometry code. * **C2**: Thermal Interface Material (T766) and finish color. * **R0**: Revision/Packaging code. --- ### 5. Common Applications * **Integrated Circuits (ICs):** Cooling FPGAs or ASICs. * **Embedded Systems:** Industrial PCs where space is limited but high heat dissipation is required. * **Power Supplies:** Cooling voltage regulators and MOSFETs.
    ✨ Follow-up Questions
    • ⤷ What are the advantages of using pushPIN™ over traditional adhesive mounting?
    • ⤷ How does the T766 thermal interface material compare to standard thermal grease?
    • ⤷ Can this heat sink be used in a passive cooling environment without fans?