ATS-08F-126-C2-R0
AI

The **ATS-08F-126-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, known for its low-profile design and high surface area.
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### 1. Technical Specifications
The following table outlines the physical and thermal properties of the component:
| Feature | Specification |
| :--- | :--- |
| **Product Type** | Passive Heat Sink |
| **Material** | Aluminum (Blue Anodized finish) |
| **Attachment Method** | pushPIN™ (Spring-loaded) |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm |
| **Fin Style** | maxiFLOW (Tapered Fin) |
| **Thermal Resistance** | 2.03°C/W @ 200 LFM |
| **Compliance** | RoHS Compliant |
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### 2. Key Electronic & Mechanical Features
#### A. Thermal Performance
The "maxiFLOW" design is engineered to reduce air pressure drop while maximizing the surface area available for heat dissipation. This makes it ideal for high-density electronic assemblies where airflow might be restricted.
#### B. Mounting System (pushPIN™)
The part uses a **pushPIN™** mechanism. In electronics, this is critical because:
* **Constant Pressure:** It ensures the heat sink maintains firm contact with the processor or chip (IC).
* **Reliability:** The brass component and stainless steel spring provide a secure fit that resists vibration.
* **Installation:** It allows for quick assembly on a PCB (Printed Circuit Board) using pre-drilled holes.
#### C. Interface Material (TIM)
The "R0" suffix typically indicates that the part comes with **pre-applied Thermal Interface Material (TIM)**. This is a specialized paste or pad that fills microscopic air gaps between the chip surface and the heat sink to improve heat transfer.
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### 3. Typical Applications
This specific heat sink size (54mm) is commonly used to cool the following electronic components:
* **FPGAs & ASICs:** High-speed processing chips that generate significant heat.
* **CPUs/GPUs:** Small form-factor processors in industrial computing.
* **Telecommunications Gear:** Network switches and routers where vertical space is limited to 15mm.
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- ⤷
What is the difference between blue anodized and black anodized coatings for heat sinks?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for my specific PCB layout?
- ⤷ What are the hole diameter requirements for the pushPIN mounting system?