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  • ATS-08F-126-C2-R0

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    The **ATS-08F-126-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **maxiFLOW™** product line, known for its low-profile design and high surface area. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Product Type** | Passive Heat Sink | | **Material** | Aluminum (Blue Anodized finish) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Fin Style** | maxiFLOW (Tapered Fin) | | **Thermal Resistance** | 2.03°C/W @ 200 LFM | | **Compliance** | RoHS Compliant | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Performance The "maxiFLOW" design is engineered to reduce air pressure drop while maximizing the surface area available for heat dissipation. This makes it ideal for high-density electronic assemblies where airflow might be restricted. #### B. Mounting System (pushPIN™) The part uses a **pushPIN™** mechanism. In electronics, this is critical because: * **Constant Pressure:** It ensures the heat sink maintains firm contact with the processor or chip (IC). * **Reliability:** The brass component and stainless steel spring provide a secure fit that resists vibration. * **Installation:** It allows for quick assembly on a PCB (Printed Circuit Board) using pre-drilled holes. #### C. Interface Material (TIM) The "R0" suffix typically indicates that the part comes with **pre-applied Thermal Interface Material (TIM)**. This is a specialized paste or pad that fills microscopic air gaps between the chip surface and the heat sink to improve heat transfer. --- ### 3. Typical Applications This specific heat sink size (54mm) is commonly used to cool the following electronic components: * **FPGAs & ASICs:** High-speed processing chips that generate significant heat. * **CPUs/GPUs:** Small form-factor processors in industrial computing. * **Telecommunications Gear:** Network switches and routers where vertical space is limited to 15mm. ---
    ✨ Follow-up Questions
    • ⤷ What is the difference between blue anodized and black anodized coatings for heat sinks?
    • ⤷ How do I calculate the required LFM (Linear Feet per Minute) for my specific PCB layout?
    • ⤷ What are the hole diameter requirements for the pushPIN mounting system?