The **ATS-08F-131-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** push-pin heatsink designed for cooling integrated circuits (ICs) such as CPUs, GPUs, or FPGAs on printed circuit boards (PCBs). --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | Push-Pin (Plastic) with Brass Springs | | **Fin Type** | Straight Fin | | **Dimensions (L x W x H)** | 35.0mm x 35.0mm x 30.0mm | | **Thermal Resistance** | 3.60 °C/W (at 200 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Design and Component Breakdown #### A. The Heatsink Body * **Material:** It is made from extruded aluminum. The blue anodized finish is not just for aesthetics; it increases the surface emissivity, slightly improving radiant heat transfer and providing corrosion resistance. * **Fin Geometry:** The "Straight Fin" design is optimized for **forced air cooling**. Air must flow through the channels between the fins to effectively carry heat away from the base. #### B. The Attachment System (Push-Pins) * **Precision Springs:** The part uses a spring-loaded push-pin system. This ensures a consistent "clamping force" (pressure) between the heatsink and the electronic chip. * **Reliability:** Unlike adhesive tapes, push-pins offer a secure mechanical connection that can withstand vibration and thermal cycling without loosening. #### C. Thermal Interface Material (TIM) * The **T766** material is pre-applied to the bottom surface. This is a specialized phase-change or grease-like material that fills microscopic air gaps between the chip and the heatsink, significantly reducing thermal resistance. --- ### 3. Application Performance Thermal performance varies based on the airflow (Linear Feet per Minute - LFM) inside the electronic enclosure: | Airflow Rate (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | **Unducted (Natural)** | 1.80 | | **200 LFM** | 3.60 | | **400 LFM** | 2.42 | | **600 LFM** | 1.91 | --- ### 4. Part Number Breakdown (Nomenclature) * **ATS**: Manufacturer (Advanced Thermal Solutions) * **08**: Series/Product Family * **F**: Fin Pitch/Style * **131**: Dimensional code (Specific to the 35mm x 35mm footprint) * **C2**: Material/Finish code (Blue Anodized) * **R0**: Revision/Packaging code