The **ATS-08F-132-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Heat Sink Type** | Fine Pitch (Cross-Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 25.00mm | | **Thermal Resistance** | ~2.66°C/W (at 100 LFM) | --- ### 2. Key Electronic Features #### A. Thermal Performance The "Fine Pitch" design increases the surface area available for heat exchange. This is critical for high-density electronic assemblies where airflow might be restricted. #### B. Attachment Mechanism (pushPIN™) Instead of messy adhesives or simple clips, this part uses a **Push-Pin** system: * **Spring-loaded:** Ensures consistent pressure (clamping force) across the component for optimal heat transfer. * **Hardware:** It typically uses brass or plastic pins with stainless steel springs. #### C. Thermal Interface Material (TIM) The "C2" in the part number indicates that it comes pre-applied with a **T766 Phase Change Material**. * This fills microscopic air gaps between the chip and the heat sink. * It improves thermal conductivity compared to using the heat sink "dry." --- ### 3. Dimensional Layout | Dimension | Measurement | | :--- | :--- | | **Length (A)** | 54.00 mm | | **Width (B)** | 54.00 mm | | **Height (C)** | 25.00 mm | | **Pitch (E)** | 47.00 mm (Distance between pins) | --- ### 4. Application Use Cases * **Embedded Systems:** Cooling processors in industrial computers. * **Telecommunications:** Managing heat in high-speed networking switches. * **Power Supplies:** Dissipating heat from large MOSFETs or IGBTs.