The **ATS-08F-142-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Fin Type** | XC (Extra Coarse) / Straight Fin | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 4.83°C/W (at 100 LFM) | | **Dimensions** | 30.00mm x 30.00mm | | **Height** | 15.00mm | | **Finish** | Blue Anodized | --- ### 2. Key Electronic Components This part is not an active electronic circuit but consists of several critical mechanical-electronic interfacing parts: 1. **Heat Sink Body:** Extruded aluminum with high thermal conductivity. The straight-fin design allows for efficient airflow in both passive and active cooling environments. 2. **Thermal Interface Material (TIM):** This specific model typically comes with **T412** thermal tape or a pre-applied phase-change material. This fills microscopic air gaps between the heat sink and the electronic chip (IC) to ensure maximum heat transfer. 3. **Push-Pin Fasteners:** The "R0" designation refers to the mounting kit. It uses plastic push-pins and springs to provide constant, uniform pressure across the component, ensuring the TIM remains effective even during vibration or temperature cycling. --- ### 3. Application Use Cases The ATS-08F-142-C1-R0 is commonly used in the following electronic systems: * **Networking Hardware:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Electronics:** Cooling MOSFETs or Voltage Regulators (VRMs) on a PCB. * **Telecommunications:** Cooling of high-speed data processing units. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 4.83 | | 200 | 1.0 | 2.50 | | 400 | 2.0 | 1.60 | | 600 | 3.0 | 1.30 |