The **ATS-08F-143-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature that defines its physical and thermal characteristics: | Property | Specification | Details | | :--- | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | Part of the *pushPIN™* series | | **Material** | Aluminum | Lightweight with high thermal conductivity | | **Finish** | Blue Anodized | Increases surface emissivity and corrosion resistance | | **Attachment Method** | pushPIN™ | Spring-loaded plastic pins for secure mounting | | **Thermal Resistance** | 7.33°C/W (Unducted) | Performance at 100 LFM (Linear Feet per Minute) | | **Dimensions** | 30mm x 30mm | Small form factor for dense PCB layouts | | **Height** | 20mm | Low profile for 1U or slim enclosures | --- ### 2. Component Design Features The "F" in the part number denotes a **Fine Pitch** design, which provides a larger surface area for heat exchange. * **Fin Style:** Straight fin design optimized for airflow in a specific direction. * **Interface Material:** Pre-applied **Phase Change Material (PCM)** or Thermal Interface Material (TIM). This fills microscopic air gaps between the component and the heat sink. * **Spring Mechanism:** Uses a compression spring to ensure constant, even pressure across the chip surface, maximizing heat transfer. --- ### 3. Thermal Performance Metrics Thermal performance varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 7.33 | | 200 (1.0 m/s) | 4.39 | | 300 (1.5 m/s) | 3.53 | | 400 (2.0 m/s) | 3.07 | --- ### 4. Implementation Example When integrating this part into a PCB design (e.g., in Altium or Eagle), the mechanical footprint must account for the **pushPIN** hole diameter. ```markdown # Mounting Hole Requirements - Hole Diameter: 3.175mm (0.125") - Pitch (Spacing): Standard 25mm - 35mm depending on clip variant ```