The **ATS-08F-148-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other integrated circuits. --- ### 1. Technical Specifications | Feature | Specification | |:---|:---| | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 8.73°C/W @ 200 LFM | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Type** | XCUT (Straight Fins) | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Part Number The alphanumeric code provides specific details about the component's construction: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **08**: Series number (Push-pin attachment style). * **F**: Fin pitch/density indicator. * **148**: Specific size and height configuration. * **C3**: Material and Finish code (typically indicates Aluminum with Blue Anodized finish). * **R0**: RoHS compliance status and revision. --- ### 3. Key Electronic Cooling Components This part is more than just a piece of metal; it integrates several functional elements: #### A. The Heat Sink Body The **XCUT** design features straight fins that are precision-cut to maximize surface area. Aluminum is used because it offers a high thermal conductivity-to-weight ratio, ensuring heat is moved away from the semiconductor die quickly. #### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this model uses **plastic push-pins** with integrated springs. - **Benefit:** It provides consistent downward pressure (clamping force) on the chip, which improves the interface between the silicon and the metal. - **Reliability:** It is more vibration-resistant than tape and allows for easy removal/rework. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied to the base. - The TIM fills microscopic air gaps between the component and the heat sink. - T412 is designed for high-performance applications where low thermal impedance is required. --- ### 4. Performance Context The performance of this part is highly dependent on airflow (measured in Linear Feet per Minute - LFM): * **Low Airflow (200 LFM):** 8.73°C/W * **High Airflow (600 LFM):** 3.11°C/W This suggests the part is optimized for "forced convection" environments (systems with active fans) rather than "natural convection" (passive cooling). ---