ATS-08F-167-C3-R0
AI

The **ATS-08F-167-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits.
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### 1. Key Technical Specifications
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum (Body), Copper (Optional Base) |
| **Finish** | Blue Anodized |
| **Attachment Type** | pushPIN™ |
| **Thermal Resistance** | 2.72°C/W (at 100 LFM) |
| **Dimensions (LxWxH)** | 45mm x 45mm x 20mm |
| **Pitch** | Fine Pitch (suitable for concentrated airflow) |
| **Thermal Interface Material** | T412 (Pre-applied) |
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### 2. Physical Design & Engineering
The part number provides specific insights into its construction:
* **Heat Sink Profile:** The "167" series features a cross-cut fin design. This creates a large surface area for heat dissipation while allowing multidirectional airflow.
* **Thermal Performance:**
* **Low Airflow (100 LFM):** 2.72°C/W
* **High Airflow (700 LFM):** 0.96°C/W
* *Note: Lower °C/W values indicate better cooling efficiency.*
* **The T412 TIM:** This is a high-performance thermal interface material pre-applied to the base. It ensures minimum thermal resistance between the component (chip) and the heat sink.
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### 3. Mounting Mechanism (pushPIN™)
The **C3-R0** suffix refers to the mounting hardware. This system replaces traditional adhesives or screws with a spring-loaded pin mechanism:
1. **Compression Springs:** These provide precise pressure (approximately 20psi) to ensure optimal contact with the heat source.
2. **Push Pins:** Usually made of brass or plastic, these snap into pre-drilled holes (approx. 3.175mm) on the PCB.
3. **Stability:** The rigid attachment prevents the heat sink from shifting during mechanical shock or vibration.
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### 4. Part Number Breakdown
```text
ATS - 08 - F - 167 - C3 - R0
| | | | | |
| | | | | +-- Revision Level
| | | | +------- Hardware/Thermal Interface (T412)
| | | +------------- Fin Pattern/Size Code
| | +------------------ Fin Pitch (F = Fine)
| +----------------------- Series (pushPIN™)
+---------------------------- Manufacturer (Advanced Thermal Solutions)
```
- ⤷
What are the specific PCB hole requirements for the pushPIN mounting system?
- ⤷ How does 'Fine Pitch' fin density compare to 'Ultra Fine Pitch' in terms of airflow resistance?
- ⤷ Can the T412 thermal interface material be replaced with aftermarket thermal paste?