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  • ATS-08F-167-C3-R0

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    The **ATS-08F-167-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "pushPIN™" series, designed for cooling electronic components such as CPUs, GPUs, and other high-heat-density integrated circuits. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (Body), Copper (Optional Base) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ | | **Thermal Resistance** | 2.72°C/W (at 100 LFM) | | **Dimensions (LxWxH)** | 45mm x 45mm x 20mm | | **Pitch** | Fine Pitch (suitable for concentrated airflow) | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Physical Design & Engineering The part number provides specific insights into its construction: * **Heat Sink Profile:** The "167" series features a cross-cut fin design. This creates a large surface area for heat dissipation while allowing multidirectional airflow. * **Thermal Performance:** * **Low Airflow (100 LFM):** 2.72°C/W * **High Airflow (700 LFM):** 0.96°C/W * *Note: Lower °C/W values indicate better cooling efficiency.* * **The T412 TIM:** This is a high-performance thermal interface material pre-applied to the base. It ensures minimum thermal resistance between the component (chip) and the heat sink. --- ### 3. Mounting Mechanism (pushPIN™) The **C3-R0** suffix refers to the mounting hardware. This system replaces traditional adhesives or screws with a spring-loaded pin mechanism: 1. **Compression Springs:** These provide precise pressure (approximately 20psi) to ensure optimal contact with the heat source. 2. **Push Pins:** Usually made of brass or plastic, these snap into pre-drilled holes (approx. 3.175mm) on the PCB. 3. **Stability:** The rigid attachment prevents the heat sink from shifting during mechanical shock or vibration. --- ### 4. Part Number Breakdown ```text ATS - 08 - F - 167 - C3 - R0 | | | | | | | | | | | +-- Revision Level | | | | +------- Hardware/Thermal Interface (T412) | | | +------------- Fin Pattern/Size Code | | +------------------ Fin Pitch (F = Fine) | +----------------------- Series (pushPIN™) +---------------------------- Manufacturer (Advanced Thermal Solutions) ```
    ✨ Follow-up Questions
    • ⤷ What are the specific PCB hole requirements for the pushPIN mounting system?
    • ⤷ How does 'Fine Pitch' fin density compare to 'Ultra Fine Pitch' in terms of airflow resistance?
    • ⤷ Can the T412 thermal interface material be replaced with aftermarket thermal paste?