The **ATS-08F-169-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **push-pin** attachment series and is specifically designed for cooling electronic components such as CPUs, GPUs, and high-power chipsets. --- ## 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08F-169-C2-R0 | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance. * **Length:** 45.00 mm * **Width:** 45.00 mm * **Height:** 10.00 mm (Low Profile) * **Hole Pattern:** 38.00 mm (Distance between push-pin holes) --- ## 3. Performance Characteristics The "C2" in the part number indicates a specific thermal configuration and material choice. ### Thermal Resistance This value indicates how many degrees Celsius the component temperature will rise per watt of power dissipated ($^\circ\text{C/W}$). Performance varies based on airflow: * **Unducted Flow:** ~15.71 $^\circ\text{C/W}$ @ 200 LFM (Linear Feet per Minute) * **High Velocity Flow:** ~6.67 $^\circ\text{C/W}$ @ 700 LFM ### Fin Design The unit features **Straight Fins**, which are optimized for high-velocity airflow environments where air is forced through the channels in a specific direction. --- ## 4. Key Components Explained 1. **Blue Anodized Finish:** This is not just for aesthetics; the anodization process provides a thin layer of protection against corrosion and slightly improves radiant heat emissivity. 2. **Push-Pin Attachment:** This uses a plastic pin and a metal spring. The spring ensures constant, even pressure on the chip, which is vital for maintaining a consistent thermal bond. 3. **T766 TIM:** The base of the heat sink comes with a pre-applied Phase Change Material (PCM). When the component heats up, this material softens to fill microscopic air gaps between the chip and the heat sink.