The **ATS-08F-171-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. This specific part belongs to the **pushPIN™** series, designed for efficient thermal management of electronic components like CPUs, GPUs, and power modules. --- ### 1. Technical Specifications The part number encodes specific physical and material properties. Below are the primary specifications: | Feature | Details | | :--- | :--- | | **Product Type** | Heat Sink | | **Material** | Aluminum (AL6063) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Finish** | Blue Anodized | | **Thermal Resistance** | 7.33°C/W (at 100 LFM) | | **Dimensions** | 30.00mm x 30.00mm x 20.00mm | | **Fin Type** | Fine Pitch (Square Pattern) | --- ### 2. Breakdown of the Model Name Electronic cooling parts use standardized naming conventions. Here is what the code stands for: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08:** Series/Specific geometry. * **F:** Fin pitch style (Fine). * **171:** Specific model/size identifier within the series. * **C2:** Material/Thermal Interface Material (TIM) type (typically indicates high-performance T766 phase-change material). * **R0:** Revision/Packaging code (Standard). --- ### 3. Key Electronic Functions In an electronic circuit, the ATS-08F-171-C2-R0 serves the following roles: 1. **Conduction:** It draws heat away from the semiconductor die via the T766 phase-change interface material. 2. **Convection:** The square-fin design maximizes surface area, allowing airflow (from a fan or natural air) to carry heat away from the board. 3. **Mechanical Stability:** The **pushPIN™** system uses a flexible, spring-loaded mechanism that ensures constant pressure on the chip without risking damage to the PCB during vibration or thermal expansion. --- ### 4. Comparison to Standard Coolers Compared to standard adhesive-based heat sinks, the ATS-08F-171-C2-R0 offers: * **Higher Reusability:** The push-pin system allows for removal and re-installation during maintenance. * **Precise Fit:** Available in over 2,000 combinations to match specific board hole patterns. * **Optimized Airflow:** The "Fine Pitch" fin design is specifically engineered for high-density electronic assemblies where space is limited but heat output is high.