The **ATS-08F-175-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Fin Type** | XCUT (Cross-cut) | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Resistance** | 13.65 °C/W (Unducted Flow @ 100 LFM) | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Design Characteristics This heat sink is engineered for modern electronic packages where space is limited but thermal loads are high. * **XCUT Fin Pattern:** The "XCUT" geometry allows for multi-directional airflow. This is particularly useful in systems where the direction of the cooling fan's exhaust is not strictly linear. * **Push-Pin Attachment:** Instead of messy adhesives or simple clips, it uses a mechanical push-pin system. This ensures consistent pressure against the chip for optimal heat transfer and prevents the heat sink from shifting due to vibration. * **T412 TIM:** It comes with a high-performance **Thermal Interface Material (TIM)** pre-applied to the base, ensuring there are no air gaps between the component and the heat sink. --- ### 3. Thermal Performance Profile The efficiency of the ATS-08F-175-C3-R0 depends heavily on the Air Velocity (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | 100 | 300 | 500 | 700 | | :--- | :---: | :---: | :---: | :---: | | **Thermal Resistance (°C/W)** | 13.65 | 6.75 | 4.62 | 3.67 | --- ### 4. Typical Applications * **Networking Equipment:** Routers, switches, and small-form-factor servers. * **Power Supplies:** Heat dissipation for MOSFETs and Voltage Regulators. * **Embedded Systems:** Industrial PCs and IoT gateways where active cooling (fans) may be restricted.