The **ATS-08F-196-C3-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, specifically designed for cooling high-power electronic components like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number provides specific information about its dimensions, material, and thermal properties. | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Base Dimensions** | 45mm x 45mm | | **Height** | 10mm | | **Material** | Aluminum (with Blue Anodized finish) | | **Thermal Resistance** | 18.22°C/W (Natural Convection) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Thermal Interface (TIM)** | T766 (High performance) | --- ### 2. Key Design Features The "electronic" functionality of this part is passive, meaning it manages heat without electricity, but its design is critical for electronic stability. * **maxiFLOW™ Fin Geometry:** The fins are designed with a tapered base and flared structure. This increases the surface area and encourages air turbulence, which significantly improves heat dissipation compared to standard rectangular fin heat sinks. * **pushPIN™ Attachment:** This model uses a plastic or brass pushPIN™ mechanism. It ensures a consistent pressure (load) on the electronic chip, which is vital for the thermal interface material to work effectively without cracking the delicate silicon die. * **Blue Anodized Coating:** Beyond aesthetics, the anodization protects the aluminum from corrosion and slightly improves the emissivity of the surface for radiative heat transfer. --- ### 3. Application in Electronics This component is typically found in the following electronic environments: 1. **Telecommunications:** Cooling high-speed switching chips. 2. **Embedded Systems:** Industrial PCs where space is limited but thermal loads are high. 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Thermal Performance Data Performance varies based on the airflow (Linear Feet per Minute - LFM) provided by system fans: | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 200 | 1.0 | 6.40 | | 400 | 2.0 | 4.80 | | 600 | 3.0 | 3.90 | ---