The **ATS-08F-199-C3-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed to provide efficient cooling for electronic components like CPUs, GPUs, and other high-heat surface-mount devices. --- ### 1. Technical Specifications The part number itself contains encoded information about its dimensions, material, and thermal properties. | Specification | Detail | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Type** | Push Pin (Plastic) | | **Thermal Resistance** | 15.95°C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 50.00mm x 50.00mm x 6.00mm | | **Fin Pattern** | Straight | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Key Design Features #### A. Fin Profile (Straight Fin) The **straight fin** design is optimized for environments with a steady flow of air (forced convection). Because the profile height is very low (6mm), it is ideal for thin electronic enclosures where space is constrained. #### B. Push Pin Attachment Unlike adhesive-based heat sinks, this uses a **mechanical push pin** system: * **Reliability:** Provides constant pressure (preload) for better thermal contact. * **Ease of Install:** Can be snapped into pre-drilled holes in the PCB. * **Longevity:** Mechanical springs don't degrade over time like some thermal tapes or glues. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied. This is a high-efficiency phase-change material or thermal pad that fills microscopic air gaps between the component and the heat sink, ensuring maximum heat transfer. --- ### 3. Application Use Cases This specific model is typically used for: 1. **Low Profile Networking:** Small switches or routers where vertical clearance is limited. 2. **FPGA Cooling:** Dissipating heat from Field Programmable Gate Arrays. 3. **Power Electronics:** Cooling MOSFETs or power modules on a dense PCB. --- ### 4. Thermal Performance Data *Measured in °C/W (lower is better):* | Airflow Velocity (LFM) | 200 | 400 | 600 | 800 | | :--- | :--- | :--- | :--- | :--- | | **Thermal Resistance** | 15.95 | 7.91 | 6.09 | 5.21 | ---