The **ATS-08F-200-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed for cooling electronic components like CPUs, GPUs, or power transistors. --- ### 1. Technical Specifications The following table summarizes the physical and thermal properties of this specific part: | Parameter | Specification | | :--- | :--- | | **Type** | Push-Pin Heat Sink (XC Cut) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54mm x 54mm x 10mm | | **Attachment Method** | Push-Pin (Brass) with Compression Spring | | **Thermal Resistance** | 9.83°C/W (Unducted Flow @ 200 LFM) | | **TIM (Thermal Interface)** | T412 (Pre-applied) | --- ### 2. Breakdown of the Model Number Advanced Thermal Solutions uses a structured nomenclature to define their parts: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08:** Series/Fin type identifier. * **F:** Fin pitch (Fine pitch for higher surface area). * **200:** Specific size/footprint code (54mm x 54mm). * **C3:** Color/Material/TIM code (Blue Anodized with T412 thermal tape). * **R0:** Revision code. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it plays a critical role in the reliability of electronic circuits: 1. **Heat Dissipation:** It increases the surface area of the heat source, allowing ambient air to carry away energy more efficiently via convection. 2. **Thermal Protection:** By maintaining the junction temperature ($T_j$) below the manufacturer's limit, it prevents **thermal runaway** and permanent hardware failure. 3. **Mechanical Attachment:** The "Push-Pin" system utilizes pre-drilled holes in the PCB. This provides a consistent downward force (pressure), ensuring the thermal interface material (TIM) fills all microscopic air gaps between the chip and the heat sink. --- ### 4. Thermal Performance Data Performance varies based on the airflow (measured in Linear Feet per Minute - LFM): | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 | 14.50 | | 300 | 7.70 | | 500 | 5.40 |