The **ATS-08F-204-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 12.70mm | | **Fin Style** | XCUT (Cross-cut) | | **Thermal Resistance** | 7.43°C/W (Unducted Flow @ 100 LFM) | | **Attachment Method** | Push-Pin (Spring Loaded) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Key Component Features #### A. XCUT Fin Design The "XCUT" geometry refers to a cross-cut straight fin design. This provides several advantages: * **Omnidirectional Airflow:** Unlike straight-fin heat sinks, XCUT designs allow air to enter and exit from multiple directions, making it more effective in systems with turbulent or inconsistent airflow. * **Surface Area:** The cross-cuts increase the total surface area for heat radiation without significantly increasing the footprint. #### B. pushPIN™ Attachment System This part uses a specific mounting mechanism: * **Push-Pins:** Plastic or brass pins that snap into pre-drilled holes on the PCB. * **Compression Springs:** These ensure consistent pressure is applied between the heat sink and the component, optimizing thermal transfer. #### C. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the chip to reduce thermal resistance. --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by ATS: | Code | Meaning | | :--- | :--- | | **ATS** | Advanced Thermal Solutions (Brand) | | **08** | Product Series | | **F** | Fine Pitch Fin Spacing | | **204** | Specific dimension/geometry code | | **C2** | Material/Finish (Aluminum / Blue Anodize) | | **R0** | RoHS Compliant Version | --- ### 4. Implementation Considerations * **Clearance:** Ensure the 12.70mm height fits within your enclosure (Low-profile design). * **PCB Holes:** The PCB must have specific drill holes to accommodate the push-pins. * **Thermal Budget:** With a thermal resistance of 7.43°C/W, this is best suited for medium-power components. If your chip produces 10W of heat, the temperature of the chip will rise approximately 74.3°C above ambient air temperature.