The **ATS-08F-208-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors and integrated circuits (ICs). --- ### 1. Technical Specifications The following table outlines the mechanical and thermal characteristics of the part: | Characteristic | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | pushPIN™ (Spring-loaded) | | **Dimension (Length x Width)** | 70.00 mm x 70.00 mm | | **Height (Fin Depth)** | 10.00 mm | | **Pitch / Pattern** | 1.27 mm (Approximate) | | **Thermal Resistance** | 10.53°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material** | T766 (Pre-applied) | --- ### 2. Design & Features #### A. Fin Geometry This model features a **Flat-Back** or **Super-Fine Pitch** design. The low-profile height (10mm) makes it ideal for high-density electronic assemblies where vertical clearance is limited (e.g., 1U servers or thin networking hardware). #### B. The pushPIN™ Attachment System Instead of using messy adhesives or permanent solder, this part uses a spring-loaded pin mechanism: * **Engagement:** The pins click into pre-drilled holes on the PCB. * **Constant Pressure:** The springs provide precise, uniform pressure across the component surface, ensuring optimal heat transfer. * **Maintenance:** It allows for easy removal and re-installation without damaging the motherboard. #### C. Thermal Interface Material (TIM) The unit comes pre-applied with **T766**. This is a high-performance thermal grease/pad that fills microscopic air gaps between the heat sink and the chip, significantly reducing thermal resistance. --- ### 3. Applications The ATS-08F-208-C2-R0 is typically used for cooling: * **FPGA & ASICs:** High-speed processors in telecommunications. * **Power Modules:** Large surface area voltage regulators. * **Embedded Systems:** Industrial PCs where fan noise must be minimized by using large passive surface areas. ---