ATS-08F-21-C2-R0
AI

The **ATS-08F-21-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** push-pin heat sink designed for cooling integrated circuits (ICs) and other electronic components on a Printed Circuit Board (PCB).
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### 1. Technical Specifications
Below is a breakdown of the physical and thermal properties of the component:
| Feature | Specification |
|:---|:---|
| **Manufacturer** | Advanced Thermal Solutions, Inc. |
| **Heat Sink Type** | Push-Pin (Spring-loaded) |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Dimensions** | 60mm x 60mm x 10mm |
| **Thermal Resistance** | 16.28°C/W (Natural Convection) |
| **Attachment Method** | Plastic Push-Pin with Brass Spring |
| **Fin Style** | Straight Fin |
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### 2. Design and Components
The part is engineered to provide efficient heat dissipation through several key electronic hardware features:
* **Push-Pin Attachment:** The "08F" series utilizes a push-pin mechanism. This allows for easy assembly and provides a consistent "clamping force" onto the electronic chip, ensuring the thermal interface material (TIM) makes perfect contact.
* **Low Profile:** At only 10mm high, it is designed for space-constrained electronics (like servers or thin networking hardware) where vertical clearance is limited.
* **Blue Anodization:** The surface treatment is not just for aesthetics; it increases the emissivity of the aluminum, slightly improving radiation heat transfer and protecting the metal from environmental corrosion.
* **Material (Al6063):** Chosen for its high thermal conductivity, allowing heat to move rapidly from the chip's surface to the fins.
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### 3. Thermal Performance (Airflow Data)
The efficiency of this part depends heavily on the velocity of the air passing through the fins (measured in Linear Feet per Minute - LFM).
| Air Velocity (LFM) | Thermal Resistance (°C/W) |
|:---|:---|
| 200 (1.0 m/s) | 7.14 |
| 400 (2.0 m/s) | 3.22 |
| 600 (3.0 m/s) | 2.01 |
| 800 (4.0 m/s) | 1.55 |
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### 4. Part Number Decoder
The nomenclature **ATS-08F-21-C2-R0** can be broken down as follows:
* **ATS**: Advanced Thermal Solutions.
* **08**: Series/Base plate size category.
* **F**: Fin geometry (Straight).
* **21**: Specific dimension/configuration code.
* **C2**: Material and Finish (Blue Anodized Aluminum).
* **R0**: Revision/Packaging code.
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What type of Thermal Interface Material (TIM) is recommended for this heat sink?
- ⤷ How do I calculate the correct hole diameter on my PCB for the push-pin attachment?
- ⤷ Can this heat sink be used for passive cooling without a fan?