The **ATS-08F-29-C1-R0** is an electronic component primarily classified as a **High-Performance Heat Sink**. It is manufactured by Advanced Thermal Solutions (ATS) and is part of their "pushPIN™" series. --- ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific part: | Parameter | Value / Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 70mm x 70mm x 20mm | | **Fin Style** | Straight Fin | | **Thermal Resistance (Flowing)** | 7.56 °C/W @ 100 LFM | | **Thermal Resistance (Static)** | 1.34 °C/W (at high airflow) | --- ### 2. Design Characteristics This component is designed to dissipate heat from integrated circuits (ICs) and other electronic modules: * **Straight Fin Profile:** The fins are arranged in a straight line, which is optimized for **undirectional airflow**. It is most effective when paired with a fan blowing directly through the fins. * **pushPIN™ Attachment:** This system replaces traditional adhesives or screws. It uses a flexible attachment mechanism that provides consistent pressure to the component, improving thermal interface performance. * **Material Choice:** Using Aluminum allows for a lightweight profile while maintaining high thermal conductivity. The Blue Anodized finish provides corrosion resistance and increased emissivity. --- ### 3. Application Use-Cases The ATS-08F-29-C1-R0 is typically used in environments where heat management is critical to prevent thermal throttling or component failure: 1. **Telecommunications:** Cooling for high-speed routers and switches. 2. **Embedded Systems:** Industrial PCs where space is limited but heat density is high. 3. **Power Electronics:** Dissipating heat from MOSFETs or Power Management ICs (PMICs). --- ### 4. Part Number Breakdown The nomenclature for this part can be decoded as follows: * **ATS:** Advanced Thermal Solutions (Manufacturer). * **08:** Heat sink series/fin type. * **F:** Fin pitch/Density. * **29:** Specific package size/dimensions. * **C1:** Thermal Interface Material (TIM) pre-applied. * **R0:** RoHS compliant/Revision status.