## Technical Overview: ATS-08F-33-C1-R0 The **ATS-08F-33-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It belongs to the **pushPIN™** series, designed for efficient heat dissipation from integrated circuits (ICs) and other electronic components. --- ### 1. Key Technical Specifications | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Part Series** | pushPIN™ | | **Attachment Method** | Push Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 17.38°C/W (Unducted Flow @ 100 LFM) | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### 2. Physical Dimensions Precision sizing is critical for ensuring the heat sink fits within the PCB layout without interfering with surrounding components. | Dimension | Measurement | | :--- | :--- | | **Length (Base)** | 35.00 mm | | **Width (Base)** | 35.00 mm | | **Height (Fin)** | 20.00 mm | | **Pitch (Hole-to-Hole)** | 40.00 mm | --- ### 3. Electronic Design Features * **Push-Pin Attachment:** Instead of messy adhesives or fragile clips, this part uses a plastic push-pin and a compression spring. This ensures constant, uniform pressure against the component, which is vital for optimal heat transfer. * **Cross-Cut Fin Design:** The "F" in the part number indicates a specific fin pattern designed to maximize surface area while allowing for multi-directional airflow. * **Pre-applied TIM:** The base comes with **T766 thermal phase change material**. This eliminates the need for manual application of thermal paste, reducing assembly time and ensuring a consistent thermal bond. * **Lightweight Construction:** Being made of aluminum, it provides a high strength-to-weight ratio, preventing mechanical stress on the PCB or the solder joints of the BGA/FPGA it is cooling. --- ### 4. Thermal Performance Data Performance varies based on the airflow (velocity) within the electronic enclosure: | Air Velocity | LFM (Linear Feet per Minute) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | Low | 100 | 17.38 | | Medium | 300 | 5.21 | | High | 500 | 3.20 | ---