The **ATS-08F-34-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for secure and efficient cooling of integrated circuits (ICs). --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics: | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimension (L x W)** | 35.00 mm x 35.00 mm | | **Height** | 25.00 mm | | **Pitch** | Fine-Pitch | | **Thermal Resistance** | 6.80°C/W (at 100 LFM) | | **Flow Orientation** | Vertical/Horizontal (Omnidirectional) | --- ### 2. Key Component Features * **Heat Sink Material:** Constructed from high-grade aluminum to balance weight and thermal conductivity. The **Blue Anodized** finish increases emissivity and provides corrosion resistance. * **Fin Design:** It features a "Fine-Pitch" design. This increases the surface area available for heat dissipation, making it ideal for high-density electronic assemblies with restricted airflow. * **Attachment (pushPIN™):** Unlike adhesive-based sinks, this uses a push-pin mechanism with a precise compression spring. This ensures: * Consistent pressure across the processor/component. * Simplified installation and removal. * Mechanical stability under vibration. --- ### 3. Application Use Cases This specific part is typically found in: 1. **Telecommunications:** High-speed routers and switches. 2. **Embedded Systems:** Industrial PCs and single-board computers (SBCs). 3. **Power Electronics:** Voltage regulator modules (VRMs). --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): ```text Air Velocity | Thermal Resistance (Unducted) ------------------------------------------- 100 LFM | 6.80 °C/W 200 LFM | 2.30 °C/W 300 LFM | 1.55 °C/W 400 LFM | 1.25 °C/W ```