The **ATS-08F-41-C1-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications Below are the primary mechanical and thermal characteristics of this part: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Dimensions (L x W x H)** | 40mm x 40mm x 25mm | | **Thermal Resistance** | 10.02°C/W (Unducted Flow @ 200 LFM) | | **Fin Style** | Square-Pin (XC-Cut) | | **Compliance** | RoHS Compliant | --- ### 2. Design and Component Breakdown #### A. Fin Pattern (XC-Cut) The "XC-Cut" refers to a **cross-cut square pin** design. Unlike traditional straight fins, square pins allow for multidirectional airflow. This is critical in cramped electronic enclosures where air may not be moving in a single, predictable direction. #### B. pushPIN™ Attachment The **-R0** suffix indicates the inclusion of the pushPIN™ mounting system. This consists of: * **Compression Springs:** Ensure consistent pressure (Load) across the thermal interface material (TIM). * **Plastic/Brass Push Pins:** Secure the heat sink directly to pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) Typically, these units come pre-applied with **ATS-PPS-11**, a high-performance thermal pad or grease. This fills the microscopic air gaps between the heat sink base and the electronic component to maximize heat transfer. --- ### 3. Part Number Decoder Understanding the "Electronic DNA" of the part number: | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08** | Series/Specific Design Profile | | **F** | Fine pitch fin density | | **41** | Size reference (approx. 40-45mm range) | | **C1** | Material/Finish Code (Blue Anodized Aluminum) | | **R0** | Revision and Packaging (Standard pushPIN™ kit) | --- ### 4. Applications This part is commonly found in: * **Telecommunications:** Cooling high-speed signal processors. * **Industrial PC (IPC):** Ensuring stability in fanless or low-airflow environments. * **Embedded Systems:** Protecting SoCs (System on Chips) that operate under heavy computational loads.