The **ATS-08F-47-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ### 1. Technical Specifications The part number itself follows a specific nomenclature used by ATS. Below are the primary technical characteristics: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Spring Type** | Compression Spring | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | | **Thermal Resistance** | 22.28°C/W (Unducted Flow) | | **Dimensions (L x W x H)** | 25mm x 25mm x 30mm | --- ### 2. Design and Component Breakdown #### A. Fin Profile (Straight Fin) The "F" in the part number indicates a **Straight Fin** design. This is optimized for environments where there is a consistent, unidirectional airflow. The tall fins (30mm) provide a high surface area for heat exchange relative to the small 25mm footprint. #### B. Push-Pin Mounting System Instead of using messy thermal adhesives or complex brackets, this part uses a **Push-Pin** mechanism: * **Ease of Use:** Allows for rapid assembly on a PCB with pre-drilled holes. * **Constant Pressure:** The compression springs ensure that the heat sink maintains even pressure against the heat-generating component, which is critical for efficient heat transfer. #### C. Thermal Interface Material (TIM) The unit comes with **T766** pre-applied to the base. This is a "phase-change" or high-performance pad that fills the microscopic air gaps between the component and the heat sink, significantly lowering thermal resistance. --- ### 3. Application Use Cases This specific heat sink is categorized as a "Miniature Heat Sink" and is typically found in: * **Embedded Systems:** Industrial PCs and IoT gateways. * **Telecommunications:** Cooling small chipsets on routers or switches. * **Power Supplies:** Cooling voltage regulators or MOSFETs. --- ### 4. Thermal Performance Data Performance varies based on the Air Velocity (Measured in Linear Feet per Minute - LFM): | Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 6.94 | | 400 | 4.80 | | 600 | 4.04 | | 800 | 3.62 |