The **ATS-08F-50-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the primary specifications: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ | | **Thermal Resistance** | 19.21° C/W (at 100 LFM) | | **Dimensions** | 35mm x 35mm x 15mm | | **Fin Style** | XC (Cross-Cut) / Square Fin | | **Thermal Interface Material (TIM)** | T412 (Pre-applied) | --- ### 2. Key Components & Design Features #### A. Fin Geometry (XC / Cross-Cut) The "XC" design features a cross-cut pattern. This allows for **omnidirectional airflow**, meaning the heat sink can receive air from any direction, making it ideal for systems where the airflow path is not strictly linear. #### B. pushPIN™ Attachment System This part uses a specialized mechanical attachment system instead of adhesive tape. * **Compression Springs:** Provide precise pressure (Force) to ensure optimal contact with the component. * **Plastic/Brass Push Pins:** Secure the heat sink through pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The unit comes with **T412** pre-applied. This is a high-efficiency thermal grease/pad that fills microscopic air gaps between the component surface and the heat sink base, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown Understanding the code helps in identifying the specific variant: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08:** Series/Fin Height or configuration code. * **F:** Fin Pitch (e.g., Fine or Ultra-Fine). * **50:** Specific dimension identifier (35mm in this series). * **C3:** Material/Color code (typically Blue Anodized Aluminum). * **R0:** Revision or packaging code. --- ### 4. Application Use Cases * **Embedded Systems:** Industrial PCs where space is limited but cooling is critical. * **Power Electronics:** Dissipating heat from VRMs (Voltage Regulator Modules). * **Telecommunications:** Cooling of high-speed networking chips.