The **ATS-08F-52-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions, Inc. (ATS)**. It is a high-performance **heat sink** designed for cooling electronic components like CPUs, GPUs, or power modules. ### 1. General Specifications This part belongs to the **pushPIN™** Heat Sink Assembly series, designed for easy installation and high thermal efficiency. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08F-52-C1-R0 | | **Component Type** | Heat Sink (Passive Cooling) | | **Attachment Method** | pushPIN™ (Spring-loaded pins) | | **Material** | Aluminum | | **Finish** | Blue Anodized | --- ### 2. Physical Dimensions The dimensions are critical for ensuring the heat sink fits the target Integrated Circuit (IC) and does not interfere with surrounding components on the PCB. | Dimension | Measurement | | :--- | :--- | | **Base Length (A)** | 35.00 mm | | **Base Width (B)** | 35.00 mm | | **Height (C)** | 25.00 mm | | **Pitch (F)** | 40.00 mm (Distance between pins) | --- ### 3. Thermal Performance Thermal resistance determines how effectively the part moves heat away from the chip. Lower numbers indicate better cooling. * **Thermal Resistance (Unducted Flow):** ~10.74 °C/W @ 100 LFM. * **Thermal Resistance (Ducted Flow):** ~2.31 °C/W @ 100 LFM. * **Fin Pitch:** Fine Pitch. * **Fin Pattern:** Cross-Cut (allows for multi-directional airflow). --- ### 4. Mounting & Interface The "R0" suffix usually denotes specific material or packaging variations, often indicating compliance with environmental standards. * **Attachment:** The pushPIN™ system uses a flexible, spring-loaded mechanism that provides precise pressure to optimize heat transfer. * **Thermal Interface Material (TIM):** This specific model typically comes with **T766** pre-applied thermal grease to fill microscopic air gaps between the heat sink and the chip. --- ### 5. Summary of Use Case The **ATS-08F-52-C1-R0** is best suited for: 1. **High-density PCBs:** Where space is limited but vertical clearance allows for a 25mm height. 2. **Multi-directional Airflow:** The cross-cut fin design ensures it works well even if the cooling fan isn't perfectly aligned. 3. **Industrial/Telecom:** Common in routers, switches, and embedded computing.