The **ATS-08F-57-C3-R0** is a high-performance **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed specifically for the thermal management of electronic components such as CPUs, GPUs, and power transistors. --- ### 1. Technical Specifications The following table highlights the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 13.30° C/W (Natural Convection) | | **Dimensions (L x W x H)** | 40mm x 40mm x 15mm | | **Fin Style** | Fine Pitch (Rectangular) | | **Spring Type** | Compression Spring | --- ### 2. Key Components and Design * **Aluminum Construction:** Aluminum is used for its excellent thermal conductivity and lightweight properties. * **Blue Anodized Finish:** This is not just for aesthetics; the anodization protects the aluminum from corrosion and slightly improves radiant heat emission. * **Push-Pin Attachment:** The part includes pre-drilled holes for a push-pin mounting system. This ensures a secure, consistent pressure against the electronic component (Integrated Circuit), which is vital for efficient heat transfer. * **C3 Thermal Interface Material (TIM):** The "C3" in the part number often indicates that the heat sink comes with a pre-applied thermal interface material, reducing assembly time and ensuring a bubble-free thermal bond. --- ### 3. Application Use Cases This specific heat sink is categorized under the **maxiFLOW™** or high-performance line, making it suitable for: 1. **Telecommunications:** Cooling high-speed data processing chips. 2. **Embedded Systems:** Industrial PCs where airflow might be limited. 3. **Power Supplies:** Managing heat dissipation in voltage regulators. --- ### 4. Airflow Performance (Approximate) | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 (1.0 m/s) | 4.40 | | 400 (2.0 m/s) | 3.10 | | 600 (3.0 m/s) | 2.50 |