The **ATS-08F-61-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like BGA (Ball Grid Array) chips, CPUs, or GPUs. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS to describe its physical and thermal characteristics. | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ HS | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic/Brass) | | **Thermal Resistance** | 22.07 °C/W (Unducted Flow @ 100 LFM) | | **Weight** | 16 grams (approx.) | --- ### 2. Physical Dimensions The physical footprint is critical for PCB layout and clearance. | Dimension | Measurement | | :--- | :--- | | **Length/Width** | 40.00 mm x 40.00 mm | | **Height** | 10.00 mm | | **Fin Pitch** | Fine Pitch | | **Fin Pattern** | Straight Fin | | **Push-Pin Pitch** | 45.00 mm | --- ### 3. Key Electronic Components & Materials * **Base Material (Aluminum 6063):** Chosen for its excellent thermal conductivity and lightweight properties. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** pre-applied. T412 is a thermal tape or pad that fills microscopic air gaps between the chip and the heat sink to maximize heat transfer. * **Attachment (Push-Pin):** Unlike adhesive-only sinks, the push-pin mechanism uses a spring-loaded system to provide consistent pressure (compression) on the electronic component, which improves thermal performance over time. --- ### 4. Thermal Performance Data Performance varies based on the airflow (LFM - Linear Feet per Minute) within the electronic enclosure: | Air Velocity (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (0.5 m/s) | 22.07 | | 300 (1.5 m/s) | 5.83 | | 500 (2.5 m/s) | 3.57 | | 700 (3.5 m/s) | 2.73 | --- ### 5. Application Use-Case The **ATS-08F-61-C3-R0** is commonly used in: * **Telecommunications:** High-speed routers and switches. * **Industrial PC:** Embedded systems where height (10mm) is restricted. * **Power Supplies:** Cooling MOSFETs or power regulators.