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  • ATS-08F-64-C1-R0

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    The **ATS-08F-64-C1-R0** is a specific high-performance electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **push-pin style heatsink** category, designed primarily for cooling BGA (Ball Grid Array) components such as CPUs, GPUs, and ASICs. --- ### 1. Technical Specifications The following table highlights the critical mechanical and thermal properties of this component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Body) | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 25.00mm | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.36°C/W (Unducted Flow @ 100 LFM) | | **Spring Type** | Compression Spring | --- ### 2. Physical Design Features The "electronic parts" of this assembly are not active circuits, but rather mechanical engineering elements that interface with electronic hardware: * **Fins:** It features a **Straight-Fin** design. This allows for optimal airflow in a single direction, typically used in servers or chassis where fans provide a steady stream of air across the motherboard. * **Push-Pin Attachment:** The unit uses a spring-loaded push-pin mechanism. This ensures a precise "clamping force" (pressure) on the electronic chip, which improves thermal transfer and prevents the heatsink from shifting during transport or vibration. * **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **ATS-CPX**, a high-performance thermal grease, to fill microscopic air gaps between the heatsink base and the electronic chip. --- ### 3. Usage Context In the electronics industry, this part is used for: 1. **Heat Dissipation:** Preventing thermal throttling in high-speed processors. 2. **Reliability:** Extending the lifespan of semiconductors by maintaining lower operating temperatures. 3. **Standardization:** The 40mm x 40mm footprint is a standard size for many mid-range FPGAs and networking chips. ---
    ✨ Follow-up Questions
    • ⤷What is the difference between ducted and unducted thermal resistance for this part?
    • ⤷ Are there different spring options available for the ATS-08F series?
    • ⤷ How does the blue anodized finish affect the thermal performance?