The **ATS-08F-69-C1-R0** is a specific electronic component categorized as a **High-Performance Heat Sink**, manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic devices like CPUs, GPUs, or power modules. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Product Series** | pushPIN™ Heat Sink | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Spring-loaded) | | **Thermal Resistance** | 11.46°C/W (Unducted @ 100 LFM) | | **Footprint/Size** | 45mm x 45mm | | **Height** | 20mm | | **Fin Style** | Straight Fin | --- ### 2. Design and Engineering Components The ATS-08F-69-C1-R0 is engineered with several critical sub-parts: * **Heat Sink Body:** Constructed from high-quality aluminum for optimal thermal conductivity. The "69" in the part number refers to a specific geometry (45mm length/width). * **Fin Configuration:** It features a vertical fin design that increases the surface area exposed to the surrounding air, allowing for more efficient heat transfer via convection. * **Push-Pin Attachment:** Instead of using messy thermal adhesives or complex brackets, it uses a plastic push-pin with a spring. This provides consistent pressure for thermal interface material (TIM) contact. * **Thermal Interface Material (TIM):** This specific model typically comes with **T412** phase-change material pre-applied to the base to bridge the gap between the component and the heat sink. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code `ATS-08F-69-C1-R0`: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08:** Designates the specific fin pattern or series. * **F:** Fine pitch fin spacing. * **69:** Indicates the base dimensions (45mm x 45mm). * **C1:** Denotes the height of the heat sink (20mm). * **R0:** Refers to the revision and packaging (standard commercial version). --- ### 4. Common Applications This part is frequently found in: 1. **Telecommunications:** Networking switches and routers. 2. **Computing:** Cooling chipsets on motherboards or embedded systems. 3. **Industrial:** Power supply units (PSUs) and motor controllers.