The **ATS-08F-79-C1-R0** is a specific part number for a high-performance **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. This component is part of their "maxiFLOW" product line, designed primarily for cooling electronic components like BGA (Ball Grid Array) packages. ### 1. Technical Specifications | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-08F-79-C1-R0 | | **Material** | Aluminum (Blue Anodized) | | **Attachment Method** | pushPIN™ | | **Dimensions (L x W x H)** | 25.0mm x 25.0mm x 30.0mm | | **Thermal Resistance** | 2.61°C/W (at 200 LFM) | | **Fin Style** | Straight (maxiFLOW Profile) | | **RoHS Status** | Compliant | --- ### 2. Key Electronic & Mechanical Features #### A. Thermal Management (The Core Function) The primary role of this part is to dissipate heat from integrated circuits (ICs). With a height of **30mm**, it provides a large surface area relative to its 25x25mm footprint, making it ideal for systems with vertical space but limited board "real estate." #### B. pushPIN™ Attachment System Unlike adhesive tapes that can fail over time, this part uses the **pushPIN™** system: * **Secure Fit:** Uses a brass component and a stainless steel spring to provide consistent pressure. * **Reliability:** Ensures the heat sink remains in contact with the chip during vibrations or shipping. * **Hardware:** It typically requires pre-drilled holes in the PCB. #### C. maxiFLOW™ Design The "maxiFLOW" geometry features a tapered fin design. This is engineered to: 1. **Reduce Pressure Drop:** Allowing air to flow through the fins more easily. 2. **Increase Air Turbulence:** Enhancing the transfer of heat from the metal to the surrounding air. --- ### 3. Typical Applications This specific heat sink is commonly found in: * **Networking Equipment:** Routers, switches, and base stations. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Telecom:** High-speed data processing units. --- ### 4. Part Number Breakdown (Nomenclature) * **ATS:** Manufacturer (Advanced Thermal Solutions) * **08:** Series/Size Category * **F:** Fin pitch/Density * **79:** Specific Dimension/Geometry code * **C1:** Thermal Interface Material (TIM) type (typically indicates a specific pre-applied phase-change material or pad) * **R0:** Revision or Packaging code