The **ATS-08F-79-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for efficient cooling of semiconductors like CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications The part number encodes specific physical and thermal characteristics: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight (Vertical) | | **Thermal Resistance** | 26.55 °C/W (at 100 LFM) | | **Dimensions (L x W)** | 25.00 mm x 25.00 mm | | **Height** | 30.00 mm | | **Pitch** | 2.50 mm (Fin spacing) | --- ### 2. Key Components & Design Features #### A. The Fin Array The "79" in the series designation refers to a specific fin pattern. This heat sink uses a **high-density straight fin** design. * **Purpose:** To maximize surface area for heat dissipation into the surrounding air. * **Airflow:** Designed for forced-air environments (fan-cooled) rather than passive cooling. #### B. The pushPIN™ Attachment System Unlike adhesive tapes or simple clips, this part uses a mechanical fastening system: * **Springs:** Provides consistent pressure (Pre-assembled) to ensure the thermal interface material (TIM) makes optimal contact with the chip. * **Pins:** Usually brass or plastic, designed to lock into pre-drilled holes in the PCB. #### C. Thermal Interface Material (TIM) The "R0" suffix indicates that the part typically comes with **T412 thermal tape** or a specific phase-change material pre-applied to the base. This fills microscopic air gaps between the component and the heat sink. --- ### 3. Applications This specific size (25mm x 25mm) is common in: * **Network Switches:** Cooling high-speed processing chips. * **Embedded Systems:** Industrial PCs where vertical space (30mm) is available but the footprint must be small. * **Power Supplies:** Regulating heat for MOSFETs or voltage regulators. --- ### 4. Thermal Performance Comparison *Performance varies based on airflow (LFM - Linear Feet per Minute):* | Airflow (LFM) | Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | :--- | | 100 | 0.5 | 26.55 | | 300 | 1.5 | 10.10 | | 500 | 2.5 | 7.20 | ---