The **ATS-08F-80-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for precision cooling of semiconductor devices like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications Below are the key technical parameters for this specific part number: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum (AL6063) | | **Fin Type** | Square-Cut (Fine Pitch) | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Thermal Resistance** | 7.03°C/W (at 100 LFM) | | **Dimensions** | 30.00mm x 30.00mm x 15.00mm | | **Finish** | Blue Anodized | | **Interface Material** | T412 (Thermal Interface Material pre-applied) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to define its physical characteristics: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **08**: Series/Product family. * **F**: Fin pitch/density (indicates a fine-pitch pattern for higher surface area). * **80**: Specific geometry/size code. * **C3**: Thermal performance/material classification. * **R0**: RoHS compliant version. --- ### 3. Key Electronic Functions While the heat sink itself is passive (it does not consume electricity), it performs critical functions for electronic stability: 1. **Heat Dissipation**: It conducts thermal energy away from the semiconductor junction through the **Aluminum 6063** body. 2. **Pressure Application**: The **pushPIN™** mechanism ensures a precise amount of force is applied to the chip, optimizing the contact between the silicon and the thermal interface material (TIM). 3. **Airflow Optimization**: The square-cut fin design is engineered to work with specific airflow velocities (LFM - Linear Feet per Minute) commonly found in server racks and industrial enclosures. 4. **Electrical Isolation**: The **Blue Anodized** finish provides a thin layer of non-conductive oxide, offering light electrical insulation and corrosion resistance. --- ### 4. Application Use Cases * **BGA Packaging**: Ideal for Ball Grid Array components that generate moderate to high heat in a small footprint. * **Telecommunications**: Used in routers and switches where vertical space (15mm height) is restricted. * **Embedded Systems**: Reliable for high-vibration environments due to the secure pushPIN™ mounting.