The **ATS-08F-81-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "pushPIN™" series, designed for efficient cooling of integrated circuits (ICs) and other electronic components. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of the part: | Feature | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Fin Style** | Straight (Square) | | **Attachment Type** | Push-Pin (Brass) | | **Thermal Resistance** | 14.12 °C/W (Unducted) | | **Dimensions (L x W x H)** | 30.00mm x 30.00mm x 10.00mm | | **Finish** | Blue Anodized | | **Thermal Interface Material** | T412 (Pre-applied) | --- ### 2. Detailed Electronic Part Breakdown #### A. Thermal Performance The primary role of this part in an electronic assembly is to dissipate heat. * **Thermal Resistance:** At 100 LFM (Linear Feet per Minute) airflow, the resistance is 14.12 °C/W. As airflow increases (e.g., to 700 LFM), the resistance drops to approximately 2.62 °C/W, allowing for much higher power dissipation. * **Fin Configuration:** It utilizes a **Fine Pitch** straight fin design, which maximizes the surface area for heat transfer in systems with forced-air cooling (fans). #### B. Mounting Mechanism (pushPIN™) Unlike adhesive-based heat sinks, this part uses a mechanical mounting system: * **Push-Pin:** Provides a secure, vibration-resistant attachment to the Printed Circuit Board (PCB). * **Spring-Loaded:** The brass pins are spring-loaded to ensure consistent pressure (compression) on the electronic chip, which optimizes the contact with the thermal interface material. #### C. Thermal Interface Material (TIM) The part comes with **T412** thermal tape pre-applied to the base. This eliminates the need for manual application of thermal grease. The T412 material is designed to fill microscopic air gaps between the heat sink and the component, significantly improving heat conductivity. --- ### 3. Typical Applications This specific size and thermal profile are commonly found in: * **Networking Hardware:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and power transistors. * **Consumer Electronics:** High-performance chipsets on compact motherboards.