The **ATS-08F-85-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or failure. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this part: | Parameter | Specification | | :--- | :--- | | **Series** | pushPIN™ | | **Attachment Type** | Push-Pin (Spring-loaded) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 10.00mm | | **Thermal Resistance** | 24.11 °C/W (Unducted Flow @ 100 LFM) | | **Fin Style** | Straight (Fine Pitch) | | **Interface Material** | T412 (Thermal Tape) | --- ### 2. Key Features * **pushPIN™ Attachment:** This system uses a flexible, spring-loaded mechanism that ensures a consistent and secure pressure against the heat source, improving thermal conductivity. * **High Performance Fin Design:** The "Fine Pitch" straight fin design is optimized for high-density air-flow environments, maximizing the surface area for heat exchange. * **Pre-assembled Components:** It comes with the heat sink, the push-pins, and the spring, along with pre-applied thermal interface material (TIM) to simplify the assembly process. * **Lightweight Aluminum:** Provides an excellent balance between thermal conductivity and weight, reducing mechanical stress on the Printed Circuit Board (PCB). --- ### 3. Part Number Breakdown The part number follows a specific nomenclature used by Advanced Thermal Solutions: 1. **ATS**: Manufacturer (Advanced Thermal Solutions). 2. **08**: Series/Family. 3. **F**: Fin Pitch (Fine). 4. **85**: Specific Geometric Designator. 5. **C3**: Material/Finish code (Blue Anodized Aluminum). 6. **R0**: Revision or RoHS compliance status. --- ### 4. Application Use Cases * **Embedded Systems:** Cooling small-form-factor processors. * **Telecommunications:** Dissipating heat from high-speed networking chips. * **Power Supplies:** Managing temperatures of MOSFETs or voltage regulators. * **Industrial Controls:** Cooling logic controllers in environments with restricted airflow.