The **ATS-08F-87-C3-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications The part number follows a specific nomenclature used by ATS. Below are the key physical and thermal characteristics: | Property | Details | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Style** | Straight (optimized for airflow) | | **Thermal Resistance** | Approx. 13.01°C/W (at 100 LFM) | | **Dimensions** | 35.00mm x 35.00mm x 15.00mm | --- ### 2. Design Components #### A. The Heat Sink Body The body is made of extruded aluminum. Aluminum is chosen for its excellent thermal conductivity-to-weight ratio. The "Blue Anodized" finish is not just aesthetic; it provides surface protection against corrosion and slightly improves radiant heat transfer. #### B. pushPIN™ Attachment System Unlike adhesive tapes that can fail under high heat, this model uses a mechanical **pushPIN™** system: - **Spring Loading:** Ensures constant, even pressure on the component (TIM - Thermal Interface Material). - **Security:** Prevents the heat sink from shifting during vibration or shipping. #### C. Thermal Interface Material (TIM) The "C3" in the part number indicates that the unit comes pre-applied with **T766 Phase Change Material**. This fills microscopic air gaps between the heat sink and the chip to maximize heat transfer efficiency. --- ### 3. Application Use Cases This specific heat sink is typically used in environments where vertical space is limited (15mm height) but high thermal reliability is required: * **Networking Gear:** Routers and Switches. * **Embedded Systems:** Industrial PCs and controllers. * **Power Supplies:** Cooling MOSFETs or power regulators. --- ### 4. Performance Summary The efficiency of this heat sink depends heavily on **Airflow (LFM - Linear Feet per Minute)**: | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 100 (Natural/Low) | 13.01 | | 300 (Moderate) | 4.80 | | 500 (High) | 3.20 | ---