The **ATS-08F-88-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or power transistors to prevent thermal throttling or hardware failure. --- ## 🛠️ Technical Specifications The following table outlines the physical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (Blue Anodized) | | **Thermal Resistance** | 2.30°C/W (at 100 LFM) | | **Dimensions (L x W)** | 35mm x 35mm | | **Height** | 25mm | | **Fin Style** | XCUT (Cross-cut) | | **Attachment Method** | Push-Pin | --- ## 🔍 Key Electronic Components & Features ### 1. Thermal Resistance Performance The efficiency of this part is measured by its ability to move heat away from the silicon die. * **Low Airflow (100 LFM):** 2.30°C/W * **High Airflow (700 LFM):** 0.78°C/W * *Note:* The lower the number, the more efficient the heat transfer. ### 2. XCUT Fin Design The "XCUT" geometry refers to the cross-cut straight fins. This design is highly effective for **omnidirectional airflow**, meaning it can receive cooling air from multiple directions, unlike straight-fin heat sinks which require linear airflow. ### 3. pushPIN™ Attachment System Instead of using messy thermal adhesives or complex brackets, this part uses a standardized push-pin mechanism: * **Compression Spring:** Provides precise pressure (Force) to ensure maximum contact between the component and the heat sink. * **Secure Fit:** Prevents the heat sink from shifting during mechanical vibration or shipping. ### 4. Material and Finish * **Aluminum 6063:** Provides a high thermal conductivity-to-weight ratio. * **Blue Anodized Finish:** Not only aesthetic but also provides corrosion resistance and slightly improves radiative heat transfer. --- ## 💡 Application Use-Cases This specific heat sink size (35mm x 35mm) is commonly used in: * **Networking Equipment:** Routers, switches, and modems. * **Embedded Systems:** Industrial PCs and IoT gateways. * **Power Electronics:** Voltage regulators and high-power LED drivers.