The **ATS-08F-92-C1-R0** is a specific electronic component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to their high-performance push-pin heat sink line, designed primarily for cooling Integrated Circuits (ICs) such as CPUs, GPUs, and FPGAs. --- ### 1. Technical Specifications Below are the primary physical and thermal characteristics of this component: | Feature | Specification | | :--- | :--- | | **Part Number** | ATS-08F-92-C1-R0 | | **Product Type** | Heat Sink (Passive Cooling) | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic) | | **Thermal Resistance** | 16.40°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 15.00mm | | **Fin Style** | Straight Fin | --- ### 2. Detailed Component Breakdown #### A. Thermal Interface Material (TIM) The "C1" in the part number indicates that this unit comes pre-applied with **Advanced Thermal Solutions' "Phase Change" material** (or a high-performance thermal tape). This ensures optimal heat transfer between the electronic chip and the aluminum base without requiring external thermal paste. #### B. Attachment Mechanism (Push-Pins) The "R0" designation refers to the mounting kit. This part uses **plastic push-pins** and **brass springs**. * **Benefits:** Provides consistent pressure (clamping force) on the chip, which prevents the heat sink from shifting during vibration or shipping. * **Hole Pattern:** Requires specific pre-drilled holes in the PCB for secure attachment. #### C. Material and Coating * **Aluminum Construction:** Offers a balance of lightweight properties and high thermal conductivity. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased surface emissivity (improving radiation cooling) and protects the aluminum from corrosion and electrical shorting. --- ### 3. Application Use Cases This specific heat sink is typically found in the following electronic environments: 1. **Telecommunications:** Cooling network switches and routers. 2. **Embedded Systems:** For industrial PCs where vertical space is limited (15mm height). 3. **Power Electronics:** Dissipating heat from MOSFETs or voltage regulators. --- ### 4. Part Number Decoder (ATS Standard) Understanding the nomenclature helps in identifying variations: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08:** Series identifier. * **F:** Fin pitch/density. * **92:** Specific footprint size (40x40mm). * **C1:** Thermal interface material type. * **R0:** Revision and mounting hardware type.