The **ATS-08F-93-C1-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. ### 1. Technical Specifications The following table outlines the physical and thermal properties of this specific model: | Property | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 12.29°C/W (at 1.0 m/s airflow) | | **Dimensions (L x W x H)** | 40mm x 40mm x 20mm | | **Attachment Method** | pushPIN™ (Spring-loaded) | | **Fin Type** | Straight Fin | | **Regulatory** | RoHS Compliant | --- ### 2. Key Features and Components #### A. pushPIN™ Attachment System One of the defining features of this part is the **pushPIN™** system. Unlike adhesive tapes or simple clips, this uses: * **Brass Pins:** To secure the sink to the PCB. * **Compression Springs:** To ensure consistent downward pressure (TIM - Thermal Interface Material compression), improving heat transfer efficiency. #### B. Material and Coating * **Aluminum 6063:** Provides a balance of high thermal conductivity and lightweight properties. * **Blue Anodized Coating:** This is not just for aesthetics; the anodized layer increases surface emissivity, which helps slightly with radiation cooling and provides corrosion resistance. #### C. Fin Geometry The "Straight Fin" design is optimized for **forced air cooling** (active airflow from a fan). The spacing between the fins is engineered to minimize "pressure drop" while maximizing the surface area exposed to the air. --- ### 3. Thermal Performance Profile Thermal resistance indicates how efficiently the heat sink moves heat away from the component. For the ATS-08F-93-C1-R0, performance varies based on air velocity: | Air Velocity (m/s) | Thermal Resistance (°C/W) | | :--- | :--- | | 1.0 (Unducted) | 12.29 | | 2.0 (Unducted) | 4.02 | | 3.0 (Unducted) | 2.53 | --- ### 4. Typical Applications This part is commonly found in: * **Telecommunications:** Cooling of networking ASICs. * **Embedded Systems:** Industrial PCs and controllers. * **Power Electronics:** Voltage regulators and high-speed memory modules.