The **ATS-08F-99-C1-R0** is a specific model of a high-performance **Heatsink** manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **pushPIN™** series, designed for cooling electronic components such as CPUs, GPUs, or high-power transistors. --- ### 1. Technical Specifications | Parameter | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | pushPIN™ (Spring-loaded bolts) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Vertical Fin (Straight) | | **Thermal Resistance** | 11.49°C/W (Unducted Flow @ 100 LFM) | --- ### 2. Breakdown of the Part Number The alphanumeric code follows a specific nomenclature used by Advanced Thermal Solutions: * **ATS:** Manufacturer (Advanced Thermal Solutions). * **08:** Series/Model identifier. * **F:** Fin pitch or density characteristic. * **99:** Specific footprint/size (45mm x 45mm). * **C1:** Material and Finish (Aluminum with Blue Anodized coating). * **R0:** Revision code or packaging indicator. --- ### 3. Key Electronic Cooling Features #### Thermal Management The primary purpose of this part is to increase the surface area of a heat-generating component. By transferring heat from the silicon die to the aluminum fins, the device prevents thermal throttling or hardware failure. #### PushPIN™ Attachment System Unlike adhesive tapes or simple clips, the **pushPIN™** system uses: 1. **Flexible Springs:** Provide precise pressure (Pre-assembled). 2. **Nylon or Brass Bolts:** Ensure the heatsink stays securely attached to the PCB even during vibration. 3. **Consistency:** Ensures uniform contact with the thermal interface material (TIM). #### Design Geometry * **Fin Gap:** Designed to work efficiently in both natural convection (passive) and forced air (active fan) environments. * **Blue Anodized Coating:** Not just for aesthetics; the anodization process provides a thin layer of electrical insulation and improves corrosion resistance. --- ### 4. Typical Applications * **Integrated Circuits (ICs):** Large FPGAs or ASICs. * **Power Supplies:** Cooling MOSFETs or voltage regulators. * **Embedded Systems:** Industrial PCs where space is limited but thermal output is high.