The **ATS-08G-10-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed for cooling electronic components such as CPUs, GPUs, and other high-heat integrated circuits. --- ## Technical Specifications The following table outlines the physical and thermal properties of the component: | Feature | Specification | | :--- | :--- | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push Pin (Plastic) | | **Thermal Resistance** | 7.89°C/W @ 100 LFM | | **Dimensions (L x W x H)** | 45mm x 45mm x 25mm | | **Fin Style** | Straight Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ## Key Components & Features ### 1. Thermal Performance This heat sink is designed for **forced air** environments. The "G" in the part number indicates the specific fin density and geometry optimized for high-velocity airflows. The lower the °C/W value, the better the heat dissipation. ### 2. Attachment System (Push Pins) * **Mechanism:** It uses a spring-loaded push pin mechanism. * **Ease of Use:** This allows for easy installation without the need for tools, ensuring consistent pressure across the component for optimal heat transfer. * **Hole Pattern:** Requires pre-drilled holes in the PCB. ### 3. Material and Coating * **Aluminum:** Provides a lightweight solution with excellent thermal conductivity. * **Blue Anodizing:** This is not just for aesthetics; the anodized layer provides increased corrosion resistance and slight improvements in surface emissivity. ### 4. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This ensures that microscopic air gaps between the heat sink and the electronic component are filled, significantly reducing thermal contact resistance. --- ## Typical Applications * **Embedded Systems:** Industrial PCs and controllers. * **Telecommunications:** Network switches and routers. * **Power Electronics:** Large MOSFET or IGBT cooling.