The **ATS-08G-13-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is designed to dissipate heat from electronic components like CPUs, GPUs, or high-power transistors. --- ### ## Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Series** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Fin Style** | Fine Pitch (Straight) | | **Thermal Resistance** | 13.73°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 50mm x 50mm x 15mm | --- ### ### Key Electronic & Physical Features 1. **Push-Pin Attachment**: The "R0" suffix indicates the use of a specialized push-pin mechanism. This provides the necessary compression force for high-performance thermal interface materials (TIM), ensuring the heat sink is flush against the electronic component. 2. **Thermal Efficiency**: Designed for **high-density electronic packaging**. The straight fin design is optimized for environments with forced air cooling (fans), allowing air to flow through the fins and carry heat away from the semiconductor junction. 3. **Material Properties**: The base is made of aluminum for high thermal conductivity while remaining lightweight. The **Blue Anodized** finish is not just aesthetic; it provides surface protection and slightly improves radiation heat transfer. --- ### ### Component Breakdown (Part Number Decoder) | Segment | Meaning | | :--- | :--- | | **ATS** | Manufacturer (Advanced Thermal Solutions) | | **08** | Series Identifier | | **G** | Material/Attachment Type | | **13** | Specific model/Thermal profile | | **C2** | Thermal Interface Material (T766/Phase Change) | | **R0** | Revision/Packaging Code | --- ### ### Typical Applications * **Embedded Systems**: Cooling microcontrollers and FPGAs. * **Networking Equipment**: Used on switches and routers. * **Power Supplies**: Dissipating heat from MOSFETs and voltage regulators.