The **ATS-08G-148-C2-R0** is a high-performance heat sink manufactured by **Advanced Thermal Solutions (ATS)**. It is part of the "push pin" series designed specifically for cooling electronic components like CPUs, GPUs, and power modules. --- ### Technical Specifications Below are the primary electronic and physical characteristics of this part: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (with Blue Anodized Finish) | | **Thermal Resistance** | 8.70°C/W @ 200 LFM (Airflow) | | **Attachment Method** | Push-Pin (Brass) | | **Spring Type** | Compression Spring | | **Dimensions (L x W x H)** | 35.00mm x 35.00mm x 15.00mm | | **Fin Style** | High-Performance Square Fin | | **Thermal Interface Material (TIM)** | T766 (Pre-applied) | --- ### Key Components & Design Features #### 1. Push-Pin Attachment Unlike adhesive-based heat sinks, the **R0** variant uses a mechanical push-pin system. This provides several advantages: * **Constant Pressure:** The brass pins and springs ensure uniform pressure across the component surface, maximizing heat transfer. * **Reliability:** Mechanical mounting is more resistant to vibration and thermal expansion cycles than simple thermal tape. #### 2. Thermal Interface Material (TIM) The part comes with **T766** pre-applied to the base. This is a high-conductivity material that fills microscopic air gaps between the heat sink and the electronic chip, significantly reducing thermal resistance. #### 3. Fin Geometry The "G" in the part number indicates a specific cross-cut fin geometry. This design is optimized for **omni-directional airflow**, meaning the heat sink performs well regardless of which direction the cooling fan is blowing. #### 4. Material Finish The **Blue Anodized** coating is not just for aesthetics; it provides: * Increased surface emissivity (better radiation cooling). * Corrosion resistance for the aluminum body. * Electrical insulation to prevent accidental shorts if the sink touches nearby components. --- ### Applications * **Integrated Circuits (ICs):** Cooling FPGAs and ASICs. * **Embedded Systems:** High-heat microcontrollers. * **Power Supplies:** Heat dissipation for MOSFETs or voltage regulators.