ATS-08G-16-C2-R0
AI

The **ATS-08G-16-C2-R0** is a specific electronic cooling component manufactured by **Advanced Thermal Solutions (ATS)**. It belongs to the **pushPIN™** Heat Sink series.
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### 1. Technical Specifications
This component is an aluminum heat sink designed for high-performance cooling of integrated circuits (ICs) and other electronic components.
| Feature | Specification |
| :--- | :--- |
| **Material** | Aluminum |
| **Finish** | Blue Anodized |
| **Attachment Method** | pushPIN™ (Plastic/Brass Pins) |
| **Fin Type** | Square (Grid) |
| **Thermal Resistance** | 18.08 °C/W (Unducted @ 100 LFM) |
| **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 10.00mm |
| **Flow Pattern** | Vertical/Horizontal (Omnidirectional) |
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### 2. Breakdown of the Model Number
The nomenclature for ATS parts follows a structured logic:
- **ATS**: Manufacturer (Advanced Thermal Solutions).
- **08**: Series/Configuration number.
- **G**: Length/Width dimension indicator (54mm x 54mm).
- **16**: Height (10.00mm).
- **C2**: Material and Finish (Aluminum / Blue Anodized).
- **R0**: Packaging code (standard retail/bulk).
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### 3. Key Features & Benefits
- **Omnidirectional Flow:** The square-fin (cross-cut) design allows air to pass through from any direction, making it ideal for systems where airflow direction is inconsistent or limited.
- **Pre-assembled Thermal Interface Material (TIM):** Most "R0" variants come with **T766** phase-change material or high-performance thermal tape pre-applied to the base to improve heat transfer.
- **Secure Attachment:** The pushPIN™ mechanism uses a compression spring and pin system that provides precise pressure to the processor, preventing movement during shipping or vibration.
- **Low Profile:** At only 10mm high, it is suitable for 1U server chassis or compact embedded electronics where vertical clearance is a constraint.
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### 4. Thermal Performance
Thermal resistance varies based on the airflow (measured in Linear Feet per Minute - LFM):
| Airflow Velocity (LFM) | 100 (0.5m/s) | 200 (1.0m/s) | 400 (2.0m/s) | 600 (3.0m/s) |
| :--- | :--- | :--- | :--- | :--- |
| **Resistance (°C/W)** | 18.08 | 8.36 | 4.72 | 3.55 |
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- ⤷
What is the hole-to-hole spacing required on the PCB for this heat sink?
- ⤷ What are the differences between Blue Anodized and Gold Chromate finishes for ATS heat sinks?
- ⤷ How do I calculate if the 18.08 °C/W resistance is sufficient for my specific IC?