The **ATS-08G-19-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** push-pin type heat sink designed for cooling integrated circuits (ICs) and other electronic components on a Printed Circuit Board (PCB). --- ### Technical Specifications | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. (ATS) | | **Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Thermal Resistance** | 9.77°C/W (Unducted Flow @ 100 LFM) | | **Dimensions (L x W x H)** | 40.00mm x 40.00mm x 20.00mm | | **Fin Pattern** | Fine Pitch (Straight Fin) | --- ### Key Components and Features #### 1. Push-Pin Mounting Mechanism The "R0" designation typically refers to the specific mounting hardware kit. This model uses a **Push-Pin** system: * **Ease of Assembly:** Allows for quick installation without the need for specialized tools. * **Compression Spring:** Provides precise, uniform pressure across the component surface to ensure optimal thermal contact. #### 2. Material and Coating * **Aluminum 6306:** Offers a balance between high thermal conductivity and structural rigidity. * **Blue Anodizing:** This is not just aesthetic; the anodized layer increases the surface emissivity, slightly improving radiation heat transfer and protecting the aluminum from corrosion. #### 3. High-Performance Fin Design The fins are engineered to maximize surface area while maintaining a low pressure drop. * **Convection Efficiency:** Designed to work effectively in both natural convection and forced-air (fan) environments. * **Dimensions:** At 20mm height, it is a mid-profile sink suitable for 1U or 2U chassis configurations. #### 4. Thermal Interface Material (TIM) Most ATS heat sinks in this series come pre-applied with a high-performance **Phase Change Material (PCM)** or thermal tape to eliminate air gaps between the chip and the heat sink. --- ### Typical Applications This specific part is commonly found in: * **Networking Equipment:** Routers, switches, and gateways. * **Industrial PCs:** Cooling CPUs or high-speed FPGAs. * **Power Supplies:** Dissipating heat from MOSFETs or voltage regulators.