The **ATS-08G-192-C2-R0** is a high-performance heat sink manufactured by *Advanced Thermal Solutions (ATS)*. It belongs to the **maxiFLOW™** series, designed specifically for cooling electronic components like CPUs, GPUs, and other high-heat-generating semiconductors. ### 1. Technical Specifications Below are the primary technical parameters for this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Part Number** | ATS-08G-192-C2-R0 | | **Heat Sink Type** | maxiFLOW™ (Cross-Cut) | | **Attachment Method** | pushPIN™ | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Thermal Resistance** | 2.35°C/W (at 200 LFM) | | **Dimensions (L x W x H)** | 45mm x 45mm x 30mm | --- ### 2. Key Design Features * **maxiFLOW™ Geometry:** The heat sink features a tapered fin design that maximizes surface area for radiant cooling and improves airflow through the fin field. * **pushPIN™ Attachment:** This model uses a specialized pushPIN™ mechanism with a brass component and a stainless steel spring. This ensures consistent pressure and easy installation on a PCB (Printed Circuit Board). * **Phase Change Material (TIM):** It typically comes pre-applied with a High-Performance Thermal Interface Material (TIM) to ensure efficient heat transfer from the component to the aluminum body. * **Cross-Cut Fin Pattern:** The fins are cut in a way that allows for "omni-directional" airflow, meaning it performs well regardless of which direction the fan or air intake is positioned. --- ### 3. Application Use Cases This part is commonly used in the following electronic systems: 1. **Telecommunications:** Cooling of high-speed network switches and routers. 2. **Industrial Computing:** Maintaining thermal stability for embedded processors in harsh environments. 3. **Power Electronics:** Dissipating heat from large MOSFETs or IGBT modules. --- ### 4. Thermal Performance Data Performance varies based on airflow (measured in Linear Feet per Minute - LFM): | Airflow (LFM) | Thermal Resistance (°C/W) | | :--- | :--- | | 200 | 2.35 | | 400 | 1.31 | | 600 | 0.99 | | 800 | 0.82 |