The **ATS-08G-24-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push pin" series designed for securing thermal solutions to Printed Circuit Boards (PCBs). ### 1. Technical Specifications The following table summarizes the primary physical and thermal characteristics of the component: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions, Inc. (ATS) | | **Part Number** | ATS-08G-24-C2-R0 | | **Material** | Aluminum | | **Finish** | Blue Anodized | | **Dimensions (L x W x H)** | 54.00mm x 54.00mm x 15.00mm | | **Thermal Resistance** | 8.37°C/W (at 100 LFM) | | **Attachment Method** | Push-Pin (Plastic or Brass) | | **Interface Material** | T766 (Thermal Tape/Grease) | --- ### 2. Electronic & Thermal Functionality The ATS-08G-24-C2-R0 serves a critical role in maintaining the reliability of electronic circuits: * **Passive Cooling:** It increases the surface area of the component it is attached to (such as a CPU, FPGA, or GPU), allowing heat to dissipate more efficiently into the surrounding air via convection. * **Thermal Interface Material (TIM):** The "C2" in the part number typically denotes the type of thermal interface material pre-applied to the base. This fills microscopic air gaps between the heat source and the sink to maximize heat transfer. * **Aerodynamic Design:** The "G" series usually features a **straight-fin** or **cross-cut** design, optimized for specific airflow directions within a computer chassis or industrial enclosure. ### 3. Mechanical Integration Electronic designers choose this specific part based on the following board-level requirements: 1. **Push-Pin Attachment:** Instead of using messy adhesives or permanent solder, this part uses a spring-loaded push-pin mechanism. This provides consistent pressure (clamping force) on the electronic chip, which is vital for thermal performance. 2. **Compatibility:** The 54mm footprint is designed for large-scale integrated circuits (ICs). 3. **Low Profile:** At only 15mm height, it is suitable for 1U server racks or compact electronic assemblies where vertical space is limited. --- ### 4. Component Breakdown Summary * **ATS:** Brand (Advanced Thermal Solutions). * **08:** Series/Fin Geometry identifier. * **G:** Material/Coating indicator (Aluminum/Blue Anodized). * **24:** Specific sizing code. * **C2:** Thermal Interface Material (TIM) code. * **R0:** RoHS compliance and revision status.