The **ATS-08G-26-C2-R0** is a high-performance electronic thermal management component. Specifically, it is an **Advanced Thermal Solutions (ATS)** aluminum pin-fin heat sink designed for cooling integrated circuits (ICs) and electronic modules. --- ### 1. Technical Specifications The following table summarizes the primary mechanical and thermal characteristics of this specific part: | Parameter | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions Inc. | | **Part Series** | pushPIN™ | | **Material** | Aluminum (AL6063) | | **Finish** | Blue Anodized | | **Attachment Type** | Push-Pin | | **Fin Configuration** | Fine Pitch (Pin-Fin) | | **Dimensions** | 40.00mm x 40.00mm x 10.00mm | | **Thermal Resistance** | 14.20°C/W (at 100 LFM) | --- ### 2. Breakdown of the Part Number The part number follows a specific nomenclature used by ATS to identify the physical attributes: * **ATS**: Manufacturer (Advanced Thermal Solutions). * **08G**: Specific series/size category. * **26**: Height/Dimensions identifier. * **C2**: Material and Thermal Interface Material (TIM) code. "C2" typically indicates a T766 phase-change thermal interface material. * **R0**: RoHS compliance and revision status. --- ### 3. Key Electronic Components & Features #### A. Thermal Interface Material (TIM) The "C2" designation confirms that the heat sink comes pre-applied with **T766 thermal grease or tape**. This eliminates the need for manual application of thermal paste, ensuring an air-free contact between the semiconductor (CPU/GPU/FPGA) and the heat sink. #### B. Attachment Mechanism (Push-Pins) Unlike adhesive-based heat sinks, this model uses **brass push-pins with steel springs**. This provides: * **Consistent Pressure:** Ensures the TIM is compressed correctly for maximum heat transfer. * **Reliability:** Resistant to vibration and thermal expansion that might cause adhesive to fail. #### C. Pin-Fin Geometry The "Fine Pitch" pin-fin design is optimized for **cross-flow ventilation**. This allows air to flow through the pins from any direction, making it ideal for densely packed PCBs where airflow direction may be unpredictable. --- ### 4. Typical Applications This component is generally used to cool the following types of electronic parts: * **FPGAs & ASICs:** High-speed processing units that generate localized heat. * **Telecommunications Equipment:** Routers and switches requiring long-term reliability. * **Power Supplies:** Cooling MOSFETs or power conversion modules.