The **ATS-08G-29-C2-R0** is a high-performance electronic thermal management component, specifically an **Advanced Thermal Solutions (ATS) push-pin heatsink**. It is designed to dissipate heat from electronic integrated circuits (ICs) like CPUs, GPUs, or FPGAs. --- ### 1. Technical Specifications The following table outlines the physical and thermal characteristics of this specific part number: | Feature | Specification | | :--- | :--- | | **Manufacturer** | Advanced Thermal Solutions (ATS) | | **Material** | Aluminum (Blue Anodized) | | **Dimensions** | 45mm x 45mm x 20mm | | **Fin Style** | Straight (maximized surface area) | | **Attachment Method** | Push-Pin with Brass Springs | | **Thermal Interface (TIM)** | T766 (High-performance pre-applied pad) | | **Thermal Resistance** | ~7.57° C/W @ 100 LFM | --- ### 2. Anatomy of the Part The "Electronic" aspect of this part refers to its physical integration into a Printed Circuit Board (PCB). 1. **Heat Sink Body (Aluminum):** The blue-anodized aluminum body features a high fin density. It draws heat away from the semiconductor die via conduction. 2. **The Push-Pin Mechanism:** Unlike adhesive-based sinks, this uses a mechanical attachment. It consists of a flexible plastic pin and a high-tension spring. * **Purpose:** Ensures constant, high-pressure contact between the sink and the chip. * **PCB Requirements:** Requires two pre-drilled holes in the PCB. 3. **Thermal Interface Material (TIM):** The base is pre-coated with **T766**. This is a phase-change or grease-like material that fills microscopic air gaps between the chip and the metal, significantly reducing thermal resistance. --- ### 3. Part Number Breakdown (Nomenclature) Understanding the code `ATS-08G-29-C2-R0`: * **ATS:** Manufacturer prefix. * **08:** Series identifier. * **G:** Push-pin type/configuration. * **29:** Specific size/fin geometry index. * **C2:** Blue Anodized finish. * **R0:** Revision code (standard). --- ### 4. Application Use-Case This part is typically used in industrial or high-reliability electronics where vibrations might cause adhesive heatsinks to fall off. * **Common chips:** Networking processors, high-speed ASICs, and power-dense bridge chips. * **Mounting:** The 45x45mm footprint makes it ideal for medium-to-large BGA (Ball Grid Array) packages.