ATS-08G-31-C2-R0
AI

The **ATS-08G-31-C2-R0** is a high-performance electronic thermal management component, specifically a **Heat Sink** manufactured by Advanced Thermal Solutions (ATS). It is part of the "push-pin" attachment series designed for cooling electronic components like CPUs, GPUs, or high-power transistors.
---
### 1. Technical Specifications
| Parameter | Specification |
| :--- | :--- |
| **Part Number** | ATS-08G-31-C2-R0 |
| **Material** | Aluminum (AL6063) |
| **Finish** | Blue Anodized |
| **Attachment Method** | Push-Pin (Brass) |
| **Dimensions (L x W x H)** | 54mm x 54mm x 10mm |
| **Thermal Resistance** | 25.25° C/W (at 100 LFM) |
| **Airflow Path** | High-performance foil fin geometry |
---
### 2. Key Features and Design
The "Electronic Parts" aspect of this component refers to its thermal design and mechanical integration:
* **Foil Fin Geometry:** Unlike standard extruded heat sinks, this part uses thin, high-density fins. This increases the surface area for heat dissipation without significantly increasing the weight or physical footprint.
* **Thermal Interface Material (TIM):** This specific model typically comes pre-applied with **T766**, a high-performance phase-change material that improves the thermal contact between the electronic chip and the aluminum base.
* **Push-Pin Attachment:** It utilizes a spring-loaded brass push-pin mechanism. This provides a consistent "clamping force" on the electronic package, which is critical for maintaining thermal efficiency and preventing damage to the PCB.
* **C2 Material:** The "C2" in the part number indicates a specific thermal compound and performance grade within the ATS product line.
---
### 3. Applications in Electronics
This heat sink is commonly used in the following electronic systems:
1. **Networking Hardware:** Switches, routers, and gateway devices.
2. **Embedded Systems:** Industrial PCs and single-board computers.
3. **Power Electronics:** Cooling MOSFETs or Voltage Regulator Modules (VRMs).
4. **Telecom:** High-speed data processing units.
---
### 4. Part Number Breakdown (Nomenclature)
```text
ATS - 08 - G - 31 - C2 - R0
| | | | | |
| | | | | Revision/Packaging Code
| | | | Thermal Interface Material (T766)
| | | Height/Size Variant
| | Fin Pattern/Type (High-performance foil)
| Push-Pin Size/Type
Advanced Thermal Solutions
```
- ⤷What is the difference between blue and black anodized finishes on heat sinks?
- ⤷ How do I calculate the required LFM (Linear Feet per Minute) for this part?
- ⤷ What are the PCB hole requirements for the brass push-pin attachment?